Micro-Nano Electronics and Intelligent Manufacturing
Call for Papers
Micro-Nano Electronics and Intelligent Manufacturing (CN10-1594/TN) is a professional academic technology journal that is publicly published in the field of micro-nano electronics and intelligent manufacturing. It publishes the latest research progress, new technologies, and achievements in micro-nano electronics and intelligent manufacturing as well as their intersecting fields, aiming to promote academic exchanges and the transformation of research outcomes, pushing forward the integrated development of industry, academia, and research, and elevating the level of scientific research equipment in this field.
Scope of Contributions:
This journal reports research achievements in but not limited to the following areas in the form of overviews, academic papers, and research briefs:
1.Theories and technologies of micro-nano electronics and intelligent manufacturing, including micro-nano electronic devices and circuits, material manufacturing, packaging and testing, microelectromechanical systems, integrated microsystems, embedded systems, sensor technology, storage technology, display technology, as well as hardware and software co-design, system integration design/manufacturing technologies, etc.
2.Cutting-edge applications of micro-nano electronics and intelligent manufacturing, including artificial intelligence (including biochips), intelligent control systems, intelligent manufacturing technology, robots, virtual reality, 3D printing, the Internet of Things, new energy vehicles, rail transit, aerospace, etc.
Submission Requirements:
1.Papers must be cutting-edge, innovative, with clear themes, complete structures, well-defined levels, and concise writing. Both overview papers and research papers are acceptable.
2.The academic duplication rate should not exceed 20% (including previously published articles by the same author), and multiple submissions of the same manuscript are not allowed.
3.Authors are responsible for the content of their submissions. The editorial department has the right to make technical and textual revisions to the submissions, and substantial content revisions must be approved by the author.
4.Submissions must strictly abide by national confidentiality regulations and must not involve classified information.
Writing Requirements:
1.Submissions must provide information about the author's profile, institution, contact details of the corresponding author, and research directions.
2.Provide the title, author and institution, abstract, and keywords in both Chinese and English. There should be 3 to 8 keywords related to the main content of the article and with practical significance. The abstract should be around 200 to 300 words, including the research question, process and method, results, and conclusions.
3.If the research is funded by a grant, please indicate the project name and number at the bottom of the first page of the article.
4.Figures and tables in the text should be clear. For figures drawn with software, please provide vector graphics if possible. All figures and tables must have both Chinese and English titles.
5.Each letter in formulas or foreign words must be clearly distinguished in terms of case and font style (italic or upright), and superscripts and subscripts should be clearly labeled. The same symbol in a paper should only have one meaning, and the meaning of each symbol should be explained where it first appears in the text.
6.The number of references should generally be no less than 10, and for overview articles, no less than 20. Chinese references need to be translated into English. References should be numbered in the order they appear in the text and listed at the end of the article.
Contact Information:
Submission Email: tougao@mneim.org.cn
Phone: 010-66004651-8001 (Ms. Li)
Address: 2nd Floor, Building 4, No. 7 Fengxian Middle Road, Haidian District, Beijing
Journal Homepage: https://www.sciengine.com/MNEIM/home
Note: This journal accepts submissions year-round. The editorial department adheres to the principle of peer review for manuscripts and implements rapid review, rapid publication, and priority publication to ensure timely publication of the research results of contributing authors.
icta
All questions or inquiries for further information regarding ICTA should be directed to the Conference Secretariat at:
Tel: +86-10-66026729
+86-10-66024492
Email: contact@ieee-icta.net
© Copyright (2024) ICTA All rights reserved
China is rapidly emerging as a global hub for the semiconductor industry, encompassing academia, industry, and market growth. However, young Chinese researchers, especially students, often lack opportunities to participate in IEEE conferences. Meanwhile, international peers are eager to gain firsthand insights into China’s rapidly expanding semiconductor sector. In response to these needs, ICTA was established by a group of Chinese scholars and will be held annually in China. It aims to serve as a comprehensive and advanced forum for showcasing IC design, technologies, and applications on a global scale.