On November 21-23, 2018, the first IEEE International Conference on Integrated Circuit Technology and Application (ICTA 2018), sponsored by the Beijing Science and Technology Association of Beijing and sponsored by the IEEE and the Beijing Institute of Electronics, was held at Empark Grand Hotelin Beijing by the Beijing Institute of Electronic Information and the Beijing Yandong Microelectronics Co., Ltd.Nearly 200 experts, scholars and researchers from 14 countries and regions including China, Switzerland, France, Korea, Japan, Italy, Singapore, Germany, the United States, Nigeria, Egypt, Bangladesh, Hong Kong, China and Macao attended the conference.From Yu Deming, vice-chairman of Beijing Association for Science and Technology, Li Bin, Assistant Minister of association ministry, Wang Jian, vice-chairman of service center of Beijing Association for Science and Technology, Guo Yihan, Minister of association development, Meng Kangsheng, executive vice-chairman of Beijing Institute of Electronics, Guo Huaping, vice-chairman and secretary-general of Beijing Electronic of Commerce, Yan Jun, talent exchange center of Ministry of Industry and Information Technology, Zhongguancun Real Estate Chamber of Commerce, etc.Representatives of Beijing Yandong Microelectronics Co., Ltd., Beijing Oriental Science and Technology Group Co., Ltd., and Beijing Mega-Video Electronics (Group) Co., Ltd. attended the opening ceremony.The theme of this session is "Sensors, integrated circuits and systems in the Internet of Things and 5G".ICTA 2018 organized four master-level training courses in analogue, RF, and digital design, as well as emerging AI IC design hotspots.In particular, the opening ceremony invited Dr. Stefan Heinen from Aachen University of Technology in Germany and Dr. Joseph Xie from St. Joseph University in the United States to present a conference on the challenges of RFIC complexity in academia and industry and the challenges faced by the semiconductor industry in China, as well as the needs and proposals for talent.The conference also invited six presentations from renowned international experts on popular topics in the field of integrated circuits, organized two presentations on 5G mmWave IC and Quantum IC for next-generation computing, and 23 presentations.
        The opening ceremony was presided over by the Chairman of the Technical Program Committee,Professor of  University of Science and Technology of China Lin Fujiang. Vice President Yu Deming of the Beijing Association for Science and Technology attended the opening ceremony and made a speech.President Yu pointed out that IEEE ICTA 2018 provided an opportunity for Chinese experts and scholars as well as engineers in related fields to exchange advanced technologies in the field of international integrated circuits. It is also a good platform for foreign experts to understand the progress of China's semiconductor industry. He expressed his sincere congratulations on the successful opening of ICTA 2018.In his opening speech, the President of the Conference and Professor Wang Zhihua of Tsinghua University welcomed the attending experts and scholars and introduced the significance of the ICTA International Academic Conference.ICTA 2018 is an exchange and display of the latest technological achievements in integrated circuit design, technology and application and Related Interdisciplinary fields. It aims to create a Global Frontier forum and communication platform for IC design, technology and application, to become an international flagship Conference for integrated circuits in China, and to participate in top-level technical training and academic discussions for Chinese researchers.Provides an exchange platform for enterprises to understand the latest technological achievements and development trends.The vice-chairman of the Technical Procedure Committee and researcher Liu Liyuan, Semiconductor Institute of the Chinese Academy of Sciences, introduced the general composition of the Technical Procedure Committee at the ICTA 2018 conference, as well as the review and application of papers.ICTA received 166 papers in 2018. After careful review by the members of the Technical Procedures Committee of the Conference, 73 papers were recruited, with an employment rate of 43.9%. Strict review procedures and requirements are the basis for ensuring high-quality conference level.

Organizing Committee

General Co-Chairs

Zhihua Wang, Tsinghua, China

Jan Van der Spiegel, U. Penn, USA

TPC Chair

Fujiang Lin, USTC, China

TPC Co-Chairs

Jason Woo, UCLA, USA

Yann Deval, U. Bordeaux, France

Liyuan Liu, IS-CAS, China

Focus Sessions Chairs

Tadahiro Kuroda, Keio U., Japan

Hoi-Jun Yoo, KAIST, Korea

Christian Enz, EPFL, Switzerland

Jane Gu, UC Davis, USA

Forum Chair

Huaqiang Wu, Tsinghua, China

Tutorial Chair

Howard Luong, HKUST, China

Finance Chair

Ying Zhang, BIE, China

Publication Co - Chairs

Nanjian Wu, IS - CAS, China

Mengqi Zhou, IEEE Beijing Section, China

Publicity/Website Chair

Yumei Zhou, IMECAS, China

Awards Committee Chair

James Hwang, Lehigh U., USA

Sponsorship/Exhibition Chair

Qing Wu, BIE, China

Interactive Forum Chair

Xian Tang, Tsinghua, China

Organizing Committee Chair

Huaping Guo, BIE, China

General Secretary

Ying Zhang, BIE, China

Special Session Chairs

Yann Deval, U. Bordeaux, France

Xing Zhang, Peking University, China

Hongtao Xu, Fudan Univerisity, China

Eddy Chiu, ASTRI, HK,China

Shouyi Yin,Tsinghua University, China

Xun Luo, UESTC, China

Zhiqun Li, Southeast University, China

Qingfeng Zhang, SUSTech, China

Christian Enz, EPFL, Switzerland

Yan Lu, University of Macau, Macau, China

Minge Jing, Fudan University

Hanjun Jiang, Tsinghua Univerisity, China

Dixian Zhao, Southeast University, China

Weisheng Zhao, Beihang University, China

Daquan Yu, Huatian Group, China

Xiong Zhou, UESTC, China

Quan Pan, SUSTech, China

Milin Zhang, Tsinghua University, China

Jianping Guo, Sun Yat-sen University, China

Jun Liu, Hangzhou Dianzi University, China

Judy Xilin An, SUSTech, China

Haigang Feng, Tsinghua University, China

Xu Liu, Beijing University of Technology

Weifeng Sun, Southeast University, China

Kai Kang, UESTC, China

Nanjian Wu, Institute of Semiconductors, Chinese Academy of Sciences, China

Liyuan Liu, Institute of Semiconductors, Chinese Academy of Sciences, China

Hangbing Lv, Institute of Microelectronics, Chinese Academy of Sciences, China

Peng Feng, Institute of Semiconductors, Chinese Academy of Sciences, China

Local Organization Committee

Qing Wu, BIE, China

Chunling Du, BIEI, China

Xiaohan Zhang, BIE, China

Lu Huang, BIE, China

Zilong Shi, BIE, China

Wen Yang, BIEI, China

YuanXin Gao, BIEI, China

Qiuliang Yu, BIE, China

Technical Program Committee

SC1: Building Blocks for RFIC and MMIC

Chair: Baoyong Chi, China

Co-Chair: Frank Henkel, Germany

Members:

Dixian Zhao, China

Ning Li , Japan

Rui Wu, Japan

Haigang Feng, China

Xu Meng, China

Xun Luo, China

Xiaojun Bi, China

Na Yan, China

Stefan Heinen, Germany

SC2: Analog and Mixed-Signal ICs

Chair: Sai-Weng Sin, China

Co-Chair: Qiang Li, China

Members:

Bing Liu, USA

Zhijie Chen, China

Xiong Zhou, China

Yan Lu, China

Hegong Wei, USA

Jin Wu, China

Xun Liu, USA

Hongmei Chen, China

Chenchang Zhan, China

Jianping Guo, China

SC3: Digital ICs

Chair: Zhiyi Yu, China

Co-Chair: Jun Zhou, China

Members:

Shouyi Yin, China

Jun Yang, China

Jun Han, China

Xuefei Bai, China

Youzhe Fan, USA

Duoli Zhang, China

Chao Wang, Singpore

Ke Xu, China

SC4: Modeling, CAD and Testing

Chair: Jun Liu, China

Members:

Rui Ma, USA

Mehdi Khan, China

Kai Lv, Singapore

Xiangwei Jiang, China

Ling Li, China

Runsheng Wang, China

Yuehang Xu, China

Yunqiu Wu, China

Song Chen, China

SC5: Semiconductor Process and Device Technologies

Chair: Peng Zhou, China

Co-Chair: Jincheng Zhang, China

Members:

Shibing Long, China

David Yang, China

Xingsheng Wang, China

Nuo Xu, USA

Haiyang Xu, China

Linwei Yu, China

Jie Xiong, China

Lei Liao, China

Yang Chai, China

SC6: Memory Device and Process

Chair: Judy Xilin An, China

Co-Chair: Min Zhu, China

Members:

Huaqiang Wu, China

Zhaoyun Tang, China

Jiezhi Chen, China

Yue Zhang, China

Qi Liu, China

Yimao Cai, China

Bin Gao, China

SC7: Emerging Device Technologies

Chair: Weisheng Zhao, China

Co-Chair: Hao Cai, China

Members:

Lirida Naviner, France

Jie Han, Cananda

Jian Sun, Japan

Feng Zhang, China

Hao Yan, China

You Wang, China

SC8: Packaging and Modules

Chair: Daquan Yu, China

Co-Chair: Jian Cai, China

Members:

Bing Dang, USA

Yifan Guo, China

Wenhui Zhu, China

Ming Li, China

Liqiang Cao, China

Fei Qin, China

Xiaowu Zhang, Singapore

Xingchang Wei, China

Gusung Kim, Korea

Min Miao, China

SC9: Passive ICs and Active Antennas

Chair: Qingfeng Zhang, China

Co-Chair: Bing Zhang, China

Members:

Li Yang, China

Xiuzhu Ye, China

Kuiwen Xu, China

Leilei Liu, China

Cheng Jin, China

Dongying Li, China

Sai-Wai Wong, China

Xiaolan Tang, China

Sheng Sun, China

SC10: ICs for 5G and Beyond

Chair: Zhiqun Li, China

Co-Chair: Jiangfeng Wu, China

Members:

Bo Zhao, China

He Tang, China

Kai Kang, China

Sanming Hu, China

Kaixue Ma, China

Xiaopeng Yu, China

Qin Li, China

Keping Wang, China

Ying Chen, USA

SC11: ICs for Automotive Electronics

Chair: Weifeng Sun, China

Co-Chair: Liji Wu, China

Members:

Xu Zhang, China

Xiaosen Liu, USA

Yinglai Xia, USA

Junmin Jiang, USA

Jing Zhu, China

Shaowei Zhen, China

Yangbo Yi, China

Mo Huang, China

SC12: ICs for High-Speed Connectivity

Chair: Quan Pan, China

Co-Chair: Nan Qi, China

Members:

Hao Li, USA

Cheng Li, USA

Binhao Wang, USA

Kehan Zhu, USA

Bo Wu, USA

Zhao Zhang, China

Xiangyu Meng, China

PatrickYin Chiang, China

SC13: Sensors, Imagers & ICs for Bio-Medical Applications

Chair: Hao Yu, China

Co-Chair: Milin Zhang, China

Members:

Chenjun Huang, China

Xiwei Huang, China

Xu Liu, China

Jinhong Guo, China

Woogeun Rhee, China

Yuchun Chang, China

SC14: Sensors and ICs for IoT & IoV

Chair: Eric Tsang, China

Co-Chair: Xiaojun Guo, China

Members:

Haibo Xiao, China

Eddy Chiu, China

Shutian Yuan, China

Ming Liu, China

Fan-Yung Ma, Singapore

Hanjun Jiang, China

Lei Xu, China

Peng Feng, China

Tutorials

Tutorial 1A

Design of Integrated Neural Recording Amplifiers

Yongping Xu

National University of Singapore,Singapore

Tutorial 2A

Mobile/Embedded DNNs and AI SoCs

Hoi-Jun Yoo

KAIST, Korea

Tutorial 3A

Top-Down Design of Hybrid

Analog-to-Digital Interface

for Communication SoCs

Ben Seng-Pan U

University of Macau & Synopsys

Macau, China

Tutorial 1B

A Practical Methodology of Implementing CPU in Application Processor SoC

Yi Kang

USTC, China

Plenary Talks  

RFIC Complexity a Challenge for  Academia and Industry

(Invited Paper)

 Stefan Heinen, IEEE Fellow, RWTH Aachen University,

Aachen, Germany

Keynote Lectures  

Research Progress of the Circuits and Systems for the Millimeter Wave and Terahertz Communication

Jixin Chen, SEU, China

De-embedding Measurement Method for TSV based 3D-IC

(Invited Paper)

Erping LI, IEEE Fellow, Zhejiang University, China

SOI Technology for Quantum Information Processing

Edoardo Charbon, EPFL, Switzerland;

Silvano de Franceschi, CEA-Léti

Wafer-scale Fabrication of MoS 2 and PtSe2 MOSFETs for Future-Generation Thin-Film Electronics

James Hwang, Lehigh University, Bethlehem,

Pennsylvania, USA

Compact Modeling and Short-Channel Effects of Nanowire MOS Transistors

(Invited Paper)

Hei Wong, Department of Electronic Engineering, City

University of Hong Kong,

Tat Chee Avenue, Kowloon, Hong Kong SAR, China

Memory – The Old and the New

Erxuan Ping, Hefei Changxin Memory Technology, China

Focus Sessions

Focus 1 : mmWave and RFIC for 5G

Time: 09:15-10:10 Thursday, November 22

Room: International Conference Room

Chair: Hongtao Xu, Fudan University, China

A 28GHz CMOS Phased-Array Transceiver Using LO Phase Shifter for 5G New Radio

(Invited Paper)

Kenichi Okada, Tokyo Institute of Technology, Japan

The Riemann Pump: a Technique for Carrier-Aggregation Radio-Frequency Transceivers

(Invited Paper)

Francois Rivet, Yann Deval, University of Bordeaux, France

Key Building Blocks for 5G

Millimeter-Wave Phased Array

(Invited Paper)

Dixian Zhao, Southeast University, Nanjing, China

Focus 2: Towards CMOS-compatible quantum computers

Time: 14:45-15:40 Thursday, November 22

Room: International Conference Room

Chair: Christian Enz , EPFL, Switzerland

Modeling of silicon-based qubits

Marco De Michielis, Institute for microelectronics and

microsystems (IMM), Italy

28-nm Bulk and FDSOI Cryogenic MOSFET

(Invited Paper)

Arnout Beckers, Farzan Jazaeri, Christian Enz

Ecole Polytechnique Fédérale de Lausanne, Switzerland

Interfacing Qubits via Cryo-CMOS Front Ends

(Invited Paper)

Andrea Ruffino, Yatao Peng, Edoardo Charbon

Ecole Polytechnique Fédérale de Lausanne, Switzerland