On November 13-15, 2019, the second IEEE International Conference on integrated circuit technology and application (ICTA 2019) was held in Chengdu Taihe Sofitel hotel. The conference was sponsored by IEEE SSCS Beijing, IEEE EDS Beijing and Beijing Institute of Electronics, jointly organized by IEEE CAS Chengdu, IEEE MTT-S Nanjing and Beijing Institute of Electronic Information, and jointly supported by Beijing Association for Science and Technology, University of Electronic Science and Technology of China and Chengdu Association of integrated circuit industry. More than 150 experts, scholars and researchers from China, Japan, Egypt, Australia, Hong Kong, Macao, Taiwan and other countries and regions submitted manuscripts and participated in the conference. With the theme of "sensors, integrated circuits and systems in the Internet of things and 5g", the conference aims to exchange and display the latest technological achievements in the field of integrated circuit design, technology and application and interdisciplinary integration.
At the opening ceremony, the chairman of the conference, Professor Wang Zhihua of Tsinghua University, extended a warm welcome to the participants and made a speech. Professor Wang Zhihua said that in recent years, the semiconductor industry has continued to grow. The application of 5g, IOT and AI has a significant impact on the development of the industry. New chips have been designed and applied to daily consumer electronics products to make life more convenient. China is gradually becoming an academic, industrial and market center in the semiconductor field. In the future, ICTA will play a better role in promoting academic and technological exchanges. Professor Lin Fujiang, chairman of the technical procedure Committee of the conference and professor of University of science and technology of China, attended the meeting and delivered a speech. Professor Lin Fujiang said that ICTA provides a platform for Chinese researchers, students and engineers to exchange advanced design and application in the field of integrated circuits. ICTA is also a window for foreign experts to understand the development of China's semiconductor industry. Liu Liyuan, vice chairman of the technical procedure Committee of the Congress and researcher of the Institute of semiconductors, Chinese Academy of Sciences, introduced the composition of the technical procedure Committee of the ICTA 2019 conference, as well as the review and employment of papers. The quality of this paper has been significantly improved, resulting in a very high level of research results.
This conference will focus on "RF integrated circuits and millimeter wave integrated circuits, analog and mixed signal integrated circuits, digital integrated circuits and memories, wired integrated circuits, modeling, CAD and testing, devices and processes, packaging and hybrid integration, sensors and applications, applications based on integrated circuits, emerging technologies and Applications". The conference specially invited Professor Mai peiran and Dr. Ping erxuan to give lectures on "towards energy autonomy Bluetooth low energy radio for IOT applications" and "the role of memory in big data era and its new perspectives". Experts from home and abroad were invited to give six wonderful keynote reports, four special conferences, and 20 sub conference reports, as well as on-site poster exchange.
Organizing Committee
General Co-Chairs | TPC Chair | International Advisors |
Zhihua Wang,Tsinghua,China Jun Hu,UESTC, China | Fujiang Lin, USTC, ChinaLiyuan Liu, IS-CAS, China | Jan Van der Spiegel,University of Pennsy lvania, USA Christian Enz,EPFL,Switzerland Yann Deval,University of Bordeaux,France Hui-Jun Yoo, KAIST, Korea Yong Lian, IEEE CASS, USA Ke Wu, IEEE MTT-S,Canada Albert Wang,IEEE EDS, USA Makoto Ikeda,University of Tokyo, Japan Jamcs Hwang, Lchigh University, USA Asia Pacific Liaison Tadahiro Kuroda, Keio University,Japan European Liaison Frank Henkel, IMST, Germany North America Liaison Rui Ma,Mitsubishi, USA |
Local Arrangement Co-Chairs | Invited Program Chair | |
Qiang Li,UESTC, China | Zhiqun Li, Southeast University, China | |
Tutorial Chair | Keynote Speakers Chair | |
Nanjian Wu, IS-CAS,China | Jiangfeng Wu, Tongji University, China | |
Industry Papers Chair | Student Papers Chair | |
Judy Xilin An, SUSTech, China | Xian Tang, Tsinghua, China | |
Program/Sessions Chair | Awards Committee Chair | |
Dixian Zhao,SEU,China | Sai-Weng Sin, University of Macau, China | |
Interactive Forum Chair | Submission Website Chair | |
Sheng Sun,UESTC, China Publication/Booklet ChairNanjian Wu, JOS, China | Qing Wu, BIE,China | |
Finance Chair | Sponsorship/Exhibition Chair | Conference Manager |
Ying Zhang, BIE, China | Kai Kang,UESTC, China | Xing Zhang,BIE, China |
TPC Members
1. RFIC and MMIC | 2. Analog and Mixed-Signal ICs | ||
Co-Chair: | Members: | Co-Chair: | Members: |
Dixian Zhao, Southeast University, China Bo Zhao,Zhejiang University, China | Jun Yin,University of Macau, China Xi Zhu,University of Technology Sydney, Australia Ning Li, Chuo University, Japan Zheng Wang,UESTC,China Wei Deng, Tsinghua, China Na Yan, Fudan, China Ru Wu, Tokyo Institute of Technology, Japan Haigang Feng, Tsinghua, China Xu Meng, Heifei University of Technology, China Xiaojun Bi, HUST, China | Sai-wWeng Sin, University of Macau, China Qiang Li,UESTC, China | Zhijie Chen, Beijing University of Techology, China Hongmei Chen, HFUT, China Yan Lu,University of Macau,China Jianping Guo, Sun Yat-sen University, China Lin Cheng, USTc,China Linan Li, Beijing Jiaotong University,China Chenchang Zhan,SUSTech, China Xiong Zhou,UESTC, China Wanyuan Qu, Zhejiang Univcrsity, China Xian Tang, Tsinghua SIGs,China Lei Qiu,Tongji University, China |
3. Digital ICs | 4. Wireline ICs | ||
Co-Chair: | Members: | Co-Chair: | Members: |
Zhiyi Yu, Sun Yat-Sen University, China Jun Zhou, UESTC,China
| Shouyi Yin, Tsinghua, China weiwei Shan,Southeast University, China Youzhe Fan, MaxLinear Inc.,USA Duoli Zhang, Hefei University of Techology,China ChaoWang, HUST,China Ke Xu, ZTE, China Jun Lin, Nan Jing University,China Minge Jing, Fudan University,China Li LIN, Hisilicon, China | Quan Pan, sUSTech,China Nan Qi, IS CAs,China
| Xiaoyan Gui,XJTU, China Bo Wu, BroadCom, USA Zhao Zhang, Hiroshima University, Japan Dan Li,XJTU,China Min Tan, HUST, China Xuqiang Zheng,IMECAS,China Ziqiang Wang, Tsinghua University, China Gang Zhang,Tongji University, China Feng Zhang,IMECAS,China |
5. Modeling, CAD and Testing | 6. Device and Process Technologies | ||
Co-Chair: | Members: | Co-Chair: | Members: |
Yuehang Xu,UESTC,China | Jun Liu, HDU, China Kai Lv,IME CAs, Singapore Ling Li, IME CAS,China Yunqiu wu, UESTC,China Yongxin Guo,NUs, Singapore Peng Chen, Cardiff University,UK Crupi Giovanni, University of Messina, Italy | Xingsheng Wang, HUST, China Judy Xilin An,SUST, China | Runsheng Wang, Peking University,China Jiezhi Chen,Shandong University, China Jing Wan, Fudan University, China Bin Gao, Tsinghua University, China Yi Li, HUST, China |
7. Packaging and Hybrid Integration | 8. Sensors and Applications | ||
Co-Chair: | Members: | Co-Chair: | Members: |
Jian Cai, Tsinghua University,China Daquan Yu, Xiamen University, China | Chengqiang Cui, GDUT, China Tao Hang,Shanghai Jiaotong University,China Tingyu Lin，Guangdong Semiconductor IntelligentEquipment and system Integration innovation Center, China Yingxia Liu, BIT, China Min Miao, BISTU, China Jun Wang, Fudan University, China Xingchang Wei, Zhejiang University, China Rongxiang Wu,UESTC, China Hong Xie, Flip Chip International LLC, USA Jiantao Zheng, Hisllicon, China | Hao Yu,University of Science and Technology, China
| Jinhong Guo, UESTC, China Quan Chen, The University of Hong Kong,China Fengwei An, Panasonic, Japan Gengzhen Qi,State key Laboratory of Analog and Mixed-Signal VLSI & Institute of Microelectronics, China Xu Liu, Beijing University of Technology, China Cong Shi, Chongqing University, China
|
9.IC Based Applications | 10. Emerging Technologies and Applications | ||
Co-Chair: | Members: | Co-Chair: | Members: |
Bing Zhang, Sichuan University, China Qingfeng Zhang,SUST, China
| Zihao Chen, HIT, China Yan Zhang,Southeast University, China Xiaojun Bi, HUST, China Junjun Wang, Beihang University, China Juhua Liu, Sun Yat-Sen University, China Mudasir Bashir, GmbH Villach,Austria Shaowei Liao, sCUT, China Cheng Jin, BIT, China | Haixia (Alice) Zhang, Peking University, China Haiding Sun, USTC, China
| Tao Li, Southeast University, China Lang Jiang, IC-CAS,China Mengmeng Li, IME CAS,China Zhaoliang Liao,USTC, China Wei Cao,University of California, Santa Barbara, USA
|
Tutorials
Tutorial-1A | Tutorial-1B | Tutorial-2A |
Meng-Fan Chang / NTHU, China | Zhiping Zhou / PKU, China | Jin He / Shenzhen System-on-chip key laboratory of Peking University Shenzhen Institute, China |
Tutorial-2B | Tutorial-3A | Tutorial-3B |
Tao Chen / Sibroad Microelectronics Inc., China | Yan Lu / UM, China | Nan Qi / ISCAS, China |
Plenary Talks
Towards Energy-Autonomous Bluetooth-Low-Energy Radios for IoT Applications | The Role of Memory in Big Data Era and Its New Perspectives |
Pui-In (Elvis) Mak State Key Laboratory of Analog and Mixed-Signal VLSI University of Macau, China | Er-Xuan PING Hefei Changxin Memory Technology
|
Keynote Lectures
Novel infrared photo-electronic detectors in 1-14 μm toward focal plane array chips | Application of GaN (Gallium nitride) RF power devices in basestation RF PA for mobile communications |
Yifang CHEN Fudan University, China | Jianli LIU Architecture & Cooperation wireless Product Operation Division, ZTE Corporation |
All-in-one Self-Powered Smart System
| Flexible Electronic Devices for Neuromorphic Computing Applications |
Haixia Zhang Peking University, China | Lin Chen State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, China |
Silicon Photonics Technology Applications and Processes | Low Noise Frequency Synthesis for Wireless Communications |
YU Mingbin Shanghai Institute of Microsystem and Information technology (SIMIT), Chinese Academy of Sciences Shanghai Industrial µTechnology Research Institute (SITRI) | Fa DAI School of Microelectronics, South China University of Technology, China |
Focus Sessions
Wideband CMOS mm-wave circuits design for 5G communications | Wideband microwave/mm-wave transmitter for 5G and beyond |
Kai Kang, University of Electronic Science and Technology of China | Xun Luo, UESTC |
mm-wave phase-array transceiver for 5G communication and imaging | Monoayer Molecular Crystals and Devices |
Shunli Ma, Fudan University | Lang Jiang Beijing National Laboratory for Molecular Sciences, Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences |
Planar and Nanostructured Semiconductor Ultraviolet Light Emitting Lasers and LEDs | Design of Phase-Locked Loop with Sub-100-fs Integrated Jitter for 5G Communication |
Haiding Sun University of Science and Technology of China | Zhao Zhang Hiroshima University, Japan |
Computing-in-Memory circuits design for AI Edge Devices | A Case for Agile Development of Neural Network Accelerators and Systems |
Xin Si University of Electronic Science and Technology of China | Ying Wang Institute of Computing Technology, Chinese Academy of Sciences, Beijing |
DANoC chip: Algorithm Hardware Co-design for Embedded Deep Learning | A Light-Weight Feasible Region Detection Method in Autonomous Walking Intelligent Robots |
Xichuan Zhou Chongqing University, Chongqing, China | Siyao Liu Sun Yat-sen University, China |
The Optimization of Localization and Navigation for Vision-Based Robot | Research and Application of Humanoid Robot for Artificial Intelligence Education |
Zhonghan Zhang Microelectronics Institute of Tsinghua University, China | Chenyang Zhang Shenzhen Hiwonder Technology Co.Ltd |
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China is rapidly emerging as a global hub for the semiconductor industry, encompassing academia, industry, and market growth. However, young Chinese researchers, especially students, often lack opportunities to participate in IEEE conferences. Meanwhile, international peers are eager to gain firsthand insights into China’s rapidly expanding semiconductor sector. In response to these needs, ICTA was established by a group of Chinese scholars and will be held annually in China. It aims to serve as a comprehensive and advanced forum for showcasing IC design, technologies, and applications on a global scale.
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