Organizing Committee
General Chair:
Hanming Wu, ZJU, China
TPC Co-Chairs:
Lin Cheng, USTC, China
Bo Zhao, ZJU, China
Steering Committee Members:
Xiaoyan Gui (Chair), XJTU, China
Zhiyi Yu , Sun Yat-sen U., China
Dixian Zhao, Southeast U., China
Liyuan Liu, IS-CAS, China
Fujiang Lin, USTC, China
Zhihua Wang, Tsinghua, China
Nanjian Wu, IS-CAS, China
International Advisors:
Jan Van der Spiegel, IEEE SSCS, USA
Ke Wu, IEEE MTT-S, Canada
Yong Lian, IEEE CASS, USA
Geok Ing Ng, IEEE EDS, Singapore
Giovanni Demicheli, EPFL, Switzerland
Yann Deval, U. Bordeaux, France
R. Bogdan Staszewski, UCD, Ireland
Boon S. Ooi, KAUST, Saudi Arabia
Hoi-Jun Yoo, KAIST, Korea
Makoto Ikeda, U. of Tokyo. Japan
Local Arrangement Chair:
Feibo Yu, ZJU, China
Tutorial Chair:
Yuxuan Luo, ZJU, China
Keynote Speakers Chair:
Yan Lu, U. Tsinghua, China
Industry Papers Chair:
Kai Huang, ZJU, China
Publication Chair:
Xun Liu, CUHKSZ, China
Sponsorship/Exhibition Chair:
Feijun Zheng, ZJU, China
Awards Committee Chair:
Zheng Wang, UESTC, China
Website Chair:
Ying Zhang, BJAST, China
Booklet Chair:
Rongfang Zhang, BIE, China
Finance Chair:
Tianye Jin, BIE, China
Conference Secretariat:
Fanfang Zeng, BIE, China
Qing Wu, BIE, China
Email: contact@ieee-icta.net
Conference Secretariat:
Fanfang Zeng, BIE, China
Tel: 010-66027428-9001
Tianye Jin, BIE, China
Tel: 010-66027428-9001
Jiayue Zhang, BIE,China
Email: contact@ieee-icta.net
icta
All questions or inquiries for further information regarding ICTA should be directed to the Conference Secretariat at:
Tel: +86-10-66026729
+86-10-66024492
Email: contact@ieee-icta.net
© Copyright (2024) ICTA All rights reserved
China is rapidly emerging as a global hub for the semiconductor industry, encompassing academia, industry, and market growth. However, young Chinese researchers, especially students, often lack opportunities to participate in IEEE conferences. Meanwhile, international peers are eager to gain firsthand insights into China’s rapidly expanding semiconductor sector. In response to these needs, ICTA was established by a group of Chinese scholars and will be held annually in China. It aims to serve as a comprehensive and advanced forum for showcasing IC design, technologies, and applications on a global scale.