Technical Program Committee | |
ICTA 2024 SC Chair |
No. | Topic | Chair | Institution |
SC1 | RF Circuits and Wireless Systems | Wei Deng | Tsinghua University |
SC2 | Analog and Mixed-Signal ICs | Sai Weng Sin | U. Macau |
SC3 | Power Management ICs | Jianping Guo | Sun Yat-sen U. |
SC4 | Digital ICs and Memory | Jun Zhou | UESTC |
SC5 | Wireline ICs | Feng Zhang | IME |
SC6 | Modeling, EDA and Testing | Yuehang Xu | UESTC |
SC7 | Device and Process Technologies | Zongwei Wang | Peking University |
SC8 | Packaging and Hybrid Integration | Wenhua Yang | Anhui University |
SC9 | Sensors and Applications | Fengwei An | SUSTech |
SC10 | System and Applications | Yongkui Yang | SIAT |
SC11 | Emerging Technologies and Applications | Haiding Sun | USTC |
SC12 | Intelligent Robots | Gang Chen | Sun Yat-sen U. |
SC1: RF Circuits and Wireless Systems
Co-Chair:
Wei Deng, Tsinghua University, China
Zheng Wang, UESTC, China
Members:
Xiaojun Bi, HUST, China
Haigang Feng, Tsinghua Shenzhen Institute, China
Yizhe Hu, University of Science and Technology of China, China
Hao Gao, Fudan, China
Keping Wang, Tianjing University, China
Haikun Jia, Tsinghua University, China
Shiheng Yang, UESTC, China
Jian Pan, Shanghai Jiaotong University, China
Yun Wang, Fudan University, China
Xiang Yi, South China University of Technology, China
Huizhen Qian, Xidian University, China
SC2: Analog and Mixed-Signal ICs
Chair:
Sai-Weng Sin, University of Macau, China
Co-Chair:
Jiaxin Liu, University of Electronic Science and Technology of China, China
Members:
Zhijie Chen, Beijing University of Technology, China
Yuxuan Luo, Zhejiang University, China
Xian Tang, Tsinghua University, China
Liang Qi, Shanghai Jiaotong University, China
Haoyu Zhuang, University of Electronic Science and Technology of China, China
Hao Xu, Fudan University, China
Xingyuan Tong, Xi'an University of Posts and Telecommunications, China
Yihan Zhang, Hong Kong University of Science and Technology (HKUST), China
Xiyuan Tang, Peking University, China
Huan Hu, Southern University of Science and Technology, China
Lu Jie, Tsinghua University, China
SC3:Power-management ICs
Co-Chair:
Jianping Guo, Sun Yat-sen University (SYSU), China
Chenchang Zhan, Southern University of Science and Technology (SUSTech), China
Members:
Mo Huang, University of Macau (UM), China
Wanyuan Qu, Zhejiang University (ZJU), China
Bing Yuan, Xidian University (Xidian), China
Dongfang Pan, University of Science and Technology of China (USTC), China
Xun Liu, The Chinese University of Hong Kong, Shenzhen (CUHK-SZ), China
Guigang Cai, The Hong Kong University of Science and Technology (Guangzhou) (HKUST(GZ)), China
Yingyi Yan, University of Electronic Science and Technology of China (UESTC), China
Yanhan Zeng, Guangzhou University (GZHU), China
Kai Yu, Guangdong University of Technology (GDUT), China
Zhiming Xiao, Nankai University (Nankai), China
Nan Chen, Northwestern Polytechnical University (NPU), China
Yingping Chen, Fudan University (Fudan), China
Junmin Jiang, Southern University of Science and Technology (SUSTech), China
SC4:Digital ICs and Memory
Chair:
Jun Zhou, University of Electronic Science and Technology of China (UESTC), China
Co-Chair:
Zhiyi Yu, Sun Yat-Sen University, China
Members:
Shouyi Yin, Tsinghua University, China
Xin Si, Southeast University, China
Chao Wang, Huazhong University of Science and Technology, China
Jun Lin, Nanjing University, China
Xiao Shanlin, Sun Yat-Sen University, China
Cong Shi, Chongqing University, China
Chang Liang, University of Electronic Science and Technology of China (UESTC), China
Yanan Sun, Shanghai Jiaotong University, China
Longyang Lin, Southern University of Science and Technology, China
Hao Cai, Southeast University, China
Weiwei Shi, Shenzhen University, China
Min Tian, Chongqing University, China
SC5:Wireline ICs
Co-Chair:
Feng Zhang, IMECAS, China
Dan Li, XJTU, China
Members:
Quan Pan, SUSTech, China
Zhao Zhang, ISCAS, China
Binhao Wang, OPMCAS, China
Xiaoyan Gui, XJTU, China
Nan Qi, ISCAS, China
Min Tan, HUST, China
Ziqiang Wang, Tsinghua University, China
Xiaoteng Zhao, Xidian University, China
Yuan Du, Nanjing University, China
SC6: Modeling, EDA and Testing:
Co-Chair:
Yuehang Xu, UESTC, China
Liang Zhou, Shanghai Jiaotong University, China
Members:
Min Tang, Shanghai Jiaotong University, China
Giovanni Crupi, University of Messina, Italy
Yunqiu Wu, UESTC, China
Xiue Bao, BIT, China
Peng Chen, Southeast University, China
Yonghao Jia, Southeast University, China
Letian Huang, YDI UESTC(Huzhou), China
Yang Lu, Xidian University, China
Ying Wang, NPU, China
Wenchao Chen, Zhejiang, China
SC7: Device and Process Technologies
Co-Chair:
Zongwei Wang, Peking University, China
Members:
Bin Gao, Tsinghua University, China
Siyang Liu, Southeast University, China
Jixuan Wu, Shandong University, China
Bing Chen, Xidian University , China
Wang Kang, Beihang University, China
Yi Li, Huazhong University of Science and Technology, China
Jing Ning, Xidian University, China
Qing Luo, IMECAS, China
Linfeng Sun, Beijing Institute of Technology, China
SC8: Packaging and Hybrid Integration
Co-Chair:
Wenhua Yang, Anhui University, China
Members:
Chenxi Wang, HIT, China
Jun Wang, Fudan University, China
Jintang Shang, Southeast University, China
Tao Hang, Shanghai Jiaotong University, China
Qidong Wang, IMCAS, China
Yingxia Liu, City University of Hong Kong, China
Xingchang Wei, Zhejiang University, China
Jian Cai, Tsinghua University, China
Sheng Sun, UESTC, China
Liguo Sun, USTC, China
Rongxiang Wu, UESTC, China
Chengqiang Cui, GDUT, China
Daquan Yu, Xiamen University, China
Ran He, Huawei Technologies Co., China
SC9: Sensors and Applications
Chair:
Fengwei An, SUSTech, China
Co-Chair:
Xu Liu, BJUT, China
Members:
Guoyi Yu, HUST, China
Gengzhen Qi, Sun Yat-Sen University, China
Xiwei Huang, HDU, China
Yongfu Li, Shanghai Jiaotong University, China
Jian Zhao, Shanghai Jiaotong University, China
Ka Meng Lei, University of Macau, China
Peng Feng, ISCAS, China
Runjiang Dou, ISCAS, China
SC10: System and Applications
Co-Chair:
Yongkui Yang, SIAT, CAS, China
Hao Zhang, Gusu Laboratory of Materials, China
Members:
Enyi Yao, SCUT, China
Zheng Wang, SIAT, CAS, China
Zihao Chen, HIT (Shenzhen), China
Xin Lou, Shanghai Tech University, China
Tao Tang, Zhejiang Lab, China
Yue Zheng, CUHK-Shenzhen, China
Wenbin Ye, Shenzhen University, China
Bo Wang, Singapore University of Technology and Design (SUTD), Singapore
SC11: Emerging Technologies and Applications
Co-Chair:
Haiding Sun, University of Science and Technology of China, China
Members:
Li Tao, Southeast University, China
Mengmeng Li, Institute of Microelectronics of Chinese Academy of Sciences, China
Kai Wang, Southern University of Science and Technology, China
Qiaoling Tong, Huazhong University of Science and Technology, China
Chao Shen, Fudan University, China
Ping Wang, Peking University, China
Guoqiang Wu, Wuhan University, China
SC12: Intelligent Robots
Chair:
Gang Chen, Sun Yat-sen University, China
Co-Chair:
Songping Mai, Tsinghua Shenzhen International Graduate School China
Members:
Yong Tao, Beihang University, China
Zonghui Li, Beijing Jiaotong University, China
Chun Zhang, Tsinghua University, China
Zhuo Zou, Fudan University, China
Libo Huang, National University of Defense Technology, China
Junhui Wang, National University of Defense Technology, China
Mingyu Wang, Sun Yat-sen University, China
Qi Peng, Xidian University, China
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China is rapidly emerging as a global hub for the semiconductor industry, encompassing academia, industry, and market growth. However, young Chinese researchers, especially students, often lack opportunities to participate in IEEE conferences. Meanwhile, international peers are eager to gain firsthand insights into China’s rapidly expanding semiconductor sector. In response to these needs, ICTA was established by a group of Chinese scholars and will be held annually in China. It aims to serve as a comprehensive and advanced forum for showcasing IC design, technologies, and applications on a global scale.