TPC Member
Source: | Author:pmt60cb40 | Published time: 2024-05-28 | 8514 Views | Share:



 


Technical Program Committee



ICTA 2024 SC Chair


No.TopicChairInstitution
SC1RF Circuits and Wireless SystemsWei Deng Tsinghua University
SC2Analog and Mixed-Signal ICsSai Weng Sin  U. Macau
SC3Power Management ICsJianping Guo Sun Yat-sen U.
SC4Digital ICs and MemoryJun Zhou UESTC
SC5Wireline ICsFeng Zhang IME
SC6Modeling, EDA and TestingYuehang Xu UESTC
SC7Device and Process TechnologiesZongwei Wang Peking University
SC8Packaging and Hybrid IntegrationWenhua Yang Anhui University
SC9Sensors and ApplicationsFengwei An SUSTech
SC10System and ApplicationsYongkui Yang SIAT
SC11Emerging Technologies and ApplicationsHaiding Sun USTC
SC12Intelligent RobotsGang Chen Sun Yat-sen U.


SC1: RF Circuits and Wireless Systems

Co-Chair:

Wei Deng, Tsinghua University, China

Zheng Wang, UESTC, China

Members:

Xiaojun Bi, HUST, China

Haigang Feng, Tsinghua Shenzhen Institute, China

Yizhe Hu, University of Science and Technology of China, China

Hao Gao, Fudan, China

Keping Wang, Tianjing University, China

Haikun Jia, Tsinghua University, China

Shiheng Yang, UESTC, China

Jian Pan, Shanghai Jiaotong University, China

Yun Wang, Fudan University, China

Xiang Yi, South China University of Technology, China

Huizhen Qian, Xidian University, China


SC2: Analog and Mixed-Signal ICs

Chair:

Sai-Weng Sin, University of Macau, China

Co-Chair:

Jiaxin Liu, University of Electronic Science and Technology of China, China

Members:

Zhijie Chen, Beijing University of Technology, China

Yuxuan Luo, Zhejiang University, China

Xian Tang, Tsinghua University, China

Liang Qi, Shanghai Jiaotong University, China

Haoyu Zhuang, University of Electronic Science and Technology of China, China

Hao Xu, Fudan University, China

Xingyuan Tong, Xi'an University of Posts and Telecommunications, China

Yihan Zhang, Hong Kong University of Science and Technology (HKUST), China

Xiyuan Tang, Peking University, China

Huan Hu, Southern University of Science and Technology, China

Lu Jie, Tsinghua University, China


SC3:Power-management ICs

Co-Chair:

Jianping Guo, Sun Yat-sen University (SYSU), China

Chenchang Zhan, Southern University of Science and Technology (SUSTech), China

Members:

Mo Huang, University of Macau (UM), China

Wanyuan Qu, Zhejiang University (ZJU), China

Bing Yuan, Xidian University (Xidian), China

Dongfang Pan, University of Science and Technology of China (USTC), China

Xun Liu, The Chinese University of Hong Kong, Shenzhen (CUHK-SZ), China

Guigang Cai, The Hong Kong University of Science and Technology (Guangzhou) (HKUST(GZ)), China

Yingyi Yan, University of Electronic Science and Technology of China (UESTC), China

Yanhan Zeng, Guangzhou University (GZHU), China

Kai Yu, Guangdong University of Technology (GDUT), China

Zhiming Xiao, Nankai University (Nankai), China

Nan Chen, Northwestern Polytechnical University (NPU), China

Yingping Chen, Fudan University (Fudan), China

Junmin Jiang, Southern University of Science and Technology (SUSTech), China


SC4:Digital ICs and Memory

Chair:

Jun Zhou, University of Electronic Science and Technology of China (UESTC), China

Co-Chair:

Zhiyi Yu, Sun Yat-Sen University, China

Members:

Shouyi Yin, Tsinghua University, China

Xin Si, Southeast University, China

Chao Wang, Huazhong University of Science and Technology, China

Jun Lin, Nanjing University, China

Xiao ShanlinSun Yat-Sen University, China

Cong Shi, Chongqing University, China

Chang Liang, University of Electronic Science and Technology of China (UESTC), China

Yanan Sun, Shanghai Jiaotong University, China

Longyang Lin, Southern University of Science and Technology, China

Hao Cai, Southeast University, China

Weiwei Shi, Shenzhen University, China

Min Tian, Chongqing University, China


SC5:Wireline ICs

Co-Chair:

Feng Zhang, IMECAS, China

Dan Li, XJTU, China

Members:

Quan Pan, SUSTech, China

Zhao Zhang, ISCAS, China

Binhao Wang, OPMCAS, China

Xiaoyan Gui, XJTU, China

Nan Qi, ISCAS, China

Min Tan, HUST, China

Ziqiang Wang, Tsinghua University, China

Xiaoteng Zhao, Xidian University, China

Yuan Du, Nanjing University, China


SC6: Modeling, EDA and Testing:

Co-Chair:

Yuehang Xu, UESTC, China

Liang Zhou, Shanghai Jiaotong University, China

Members:

Min Tang, Shanghai Jiaotong University, China

Giovanni Crupi, University of Messina, Italy

Yunqiu Wu, UESTC, China

Xiue Bao, BIT, China

Peng Chen, Southeast University, China

Yonghao Jia, Southeast University, China

Letian Huang, YDI UESTC(Huzhou), China

Yang Lu, Xidian University, China

Ying Wang, NPU, China

Wenchao Chen, Zhejiang, China


SC7: Device and Process Technologies

Co-Chair:

Zongwei Wang, Peking University, China 

Members:

Bin Gao, Tsinghua University, China

Siyang Liu, Southeast University, China  

Jixuan Wu, Shandong University, China

Bing Chen,  Xidian University , China

Wang Kang, Beihang University, China

Yi Li, Huazhong University of Science and Technology, China

Jing Ning, Xidian University, China

Qing Luo, IMECAS, China

Linfeng Sun, Beijing Institute of Technology, China


SC8: Packaging and Hybrid Integration

Co-Chair:

Wenhua Yang, Anhui University, China

Members:

Chenxi Wang, HIT, China

Jun Wang, Fudan University, China

Jintang Shang, Southeast University, China

Tao Hang, Shanghai Jiaotong University, China

Qidong Wang, IMCAS, China

Yingxia Liu, City University of Hong Kong, China

Xingchang Wei, Zhejiang University, China

Jian Cai, Tsinghua University, China

Sheng Sun, UESTC, China

Liguo Sun, USTC, China

Rongxiang Wu, UESTC, China

Chengqiang Cui, GDUT, China

Daquan Yu, Xiamen University, China

Ran He, Huawei Technologies Co., China


SC9: Sensors and Applications

Chair:

Fengwei An, SUSTech, China

Co-Chair:

Xu Liu, BJUT, China

Members:

Guoyi Yu, HUST, China

Gengzhen Qi, Sun Yat-Sen University, China

Xiwei Huang, HDU, China

Yongfu Li, Shanghai Jiaotong University, China

Jian Zhao, Shanghai Jiaotong University, China

Ka Meng Lei, University of Macau, China

Peng Feng, ISCAS, China

Runjiang Dou, ISCAS, China


SC10: System and Applications

Co-Chair:

Yongkui Yang, SIAT, CAS, China

Hao Zhang, Gusu Laboratory of Materials, China

Members:

Enyi Yao, SCUT, China

Zheng Wang, SIAT, CAS, China 

Zihao Chen, HIT (Shenzhen), China 

Xin Lou, Shanghai Tech University, China 

Tao Tang,  Zhejiang Lab, China

Yue Zheng, CUHK-Shenzhen, China

Wenbin Ye, Shenzhen University, China 

Bo Wang, Singapore University of Technology and Design (SUTD), Singapore


SC11: Emerging Technologies and Applications

Co-Chair:

Haiding Sun, University of Science and Technology of China, China 

Members:

Li TaoSoutheast University, China 

Mengmeng Li, Institute of Microelectronics of Chinese Academy of Sciences, China 

Kai Wang, Southern University of Science and Technology, China 

Qiaoling Tong, Huazhong University of Science and Technology, China 

Chao Shen, Fudan University, China 

Ping Wang, Peking University, China 

Guoqiang Wu, Wuhan University, China 


SC12: Intelligent Robots

Chair:

Gang Chen, Sun Yat-sen University, China

Co-Chair:

Songping Mai, Tsinghua Shenzhen International Graduate School China

Members:

Yong Tao, Beihang University, China

Zonghui Li, Beijing Jiaotong University, China

Chun Zhang, Tsinghua University, China

Zhuo Zou, Fudan University, China

Libo Huang, National University of Defense Technology, China

Junhui Wang, National University of Defense Technology, China

Mingyu Wang, Sun Yat-sen University, China 

Qi Peng, Xidian University, China


Archive:


ICTA TPC LIST 2018


ICTA TPC LIST 2019


ICTA TPC LIST 2020


ICTA TPC LIST 2021


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