1. Wireless, RFIC, and MMIC: Si-based RFIC building-block circuit, compound-semiconductor-based MMIC building-block circuit, LNA, PA, VCO, PLL, phase shifter, mixer, RF switch, balun, driver amplifier, transceiver, etc.

2. Analog and Mixed-Signal ICs:  analog circuits including amplifiers, comparators, oscillators, filters, references, nonlinear analog circuits and digitally-assisted analog circuits; data converters including Nyquist-rate and oversampling ADC and DAC, etc.

3. Power Management ICs: Power management and control circuits; switched-mode power converter ICs using inductive, capacitive, and hybrid techniques; linear regulators; gate drivers; topologies for wide-bandgap devices; power and signal isolators; LED drivers, wireless power, and envelope supply modulators; energy harvesting circuits and systems.

4. Digital ICs and Memory: SoC, processor, FPGA, AI and deep-learning processor, DSP, NoC, memory, etc.

5. Wireline ICs: high-speed data link, optical transceiver, OEIC, SerDes, TIA, CDRs, equalizer, modulator, etc.

6. Sensor ICs: MEMS sensors, image sensors, physical sensors, chemical sensors, bio-sensors, smart and intelligent sensors, sensor interface, sensor technology and applications, etc.

7. Modeling, EDA and Testing: compact models and extraction techniques (silicon based), SPICE models and extraction techniques (non-silicon), modeling technique of GaN, SiC, ASM-HEMT, 2D-material-based devices, quantum devices, test structures design and model parameter extraction, RF calibration and reliable data acquisition, EDA, EM/TCAD simulation, co-simulation and verification technique, PDK validation, etc.

8. Device and Process Technologies: CMOS, FinFET, FD-SOI, BCD, SiGe, III-V, HEMT, HBT, 3^rd generation materials, GaN, power electronics, SiC, GaO, junctionless device, negative capacitance device, MEMS, device characterization, device FAR, 3D integration, Chiplet, flash, OPT, MPT, SRAM, DRAM, 3D NAND, MRAM, RRAM, PCRAM, FeRAM, crossbar, DRAM+MCU, etc.

9. Packaging and Hybrid Integration: Chiplet, active antenna, EM field, filters, Hybrid MIC, MCM, SiP, SoP, TSV, flip chip assembly, wire bonding, anisotropic conductive film, interconnection technologies, multi-physics and multiscale EM computation/simulation, 3D integration, etc.

10. Emerging Semiconductor Materials and Devices: heterogeneous integration, III-V compounds, silicon photonics, optoelectronic device, 2D materials, green and implantable materials, neuromorphic device, device characterization, etc.

11. System and Applications: IC based module and system integration, automotive electronics, automotive radar, 5G systems, AI systems, IoTs, healthcare and biomedical systems, etc.  

12. Intelligent Robots: robot kinematics/dynamics/control, system integration, AI in robotics, sensor/actuator, bio-inspired systems, robot perception, human robot interaction, and robot vision, etc.

Paper submission and deadlines:

To encourage timely reporting of the latest results and to have better opportunities to expand papers for possible journal publications, prospective authors are invited to submit a 2-page paper (both initial submission and final version, if accepted) in English and in IEEE Xplore PDF format. The paper should emphasize original contributions and key findings, including figures, diagrams and results from verified simulations with direct or indirect measurements. Up to 2 additional pages of figures supporting initial submission which will not in final publication are encouraged. References should be clearly cited and up-to-date. Invited papers can extend up to 6 pages submission. By submitting the paper, the authors promise that, if accepted, at least one of them will attend ICTA 2024 with full registration.

Manuscript submission deadline:      July 28, 2024 

Notification of acceptance: September 5, 2024

Final submission:    September 20, 2024

Website: http://www.ieee-icta.cn or  http://www.ieee-icta.net

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