On November 23-25, 2020, the third IEEE International Conference on integrated circuit technology and Applications (ICTA 2020, conference No.: 50426) was successfully held online. The conference was sponsored by Beijing Institute of Electronics, IEEE Nanjing section (Hangzhou) MTT chapter, hosted by Southeast University, CO sponsored by CAS Chengdu, MTT-S Nanjing and Beijing Institute of Electronic Information, and supported by Beijing Association for Science and Technology. More than 150 experts, scholars and researchers from China, the United States, France, Japan, Singapore, Ireland, Nigeria, Hong Kong, Macao and other countries and regions attended the meeting. This conference is held in accordance with the relevant standards of IEEE International Conference. The theme of this year is "Internet of things and 5G sensors, integrated circuits and systems", which aims to exchange and display the latest technological achievements in the field of integrated circuit design, technology application and interdisciplinary integration in the current society. There are 2 plenary talks, 4 tutorials, 6 keynote reports, 6 special sessions and 21 sub-conference sessions.
        2020 is a special year. The new coronavirus has hit the world, has disrupted the global economy and disrupted the global supply chain, resulting in a huge short-term market uncertainty.  However, the long-term growth of semiconductors is still bright. With the new market demand of 5g, big data and AI, new opportunities will continue to open up. Professor Wang Zhihua of Tsinghua University, chairman of the conference, said in his speech
        Lin Fujiang, chair of the steering committee and professor of University of science and technology of China, attended the conference and delivered a speech. Lin Fujiang said that ICTA provides an exchange platform for Chinese researchers, engineers and students in the field of advanced design and application in the field of integrated circuits, and ICTA is also a window for foreign experts to understand the development of China's semiconductor industry. Liu Liyuan, co-chair of the technical program committee, researcher of the Institute of semiconductors, Chinese Academy of Sciences, introduced the composition of the technical procedure Committee of the ICTA 2020 conference, as well as the review and employment of papers. Zhao Dixian, co-chair of the technical program committee, professor of Southeast University, introduced the relevant information of the 2021 ICTA meeting.
       The conference will exchange technologies in 10 fields, including RF integrated circuits and millimeter wave integrated circuits, analog and mixed signal integrated circuits, digital integrated circuits and memories, wired integrated circuits, modeling, CAD and testing, devices and processes, packaging and mixed integration, sensors and applications, applications based on integrated circuits, emerging technologies and applications. Dr. Zong Baiqing from ZTE Co., Ltd. and Dr. Ben Chen from Hengtong optoelectronics Co., Ltd. were specially invited to give reports on 6G technologies opportunities and challenges and trends in optoelectronic IC for recent optical module and photonics integration respectively.

Organizing Committee

General Co-Chair:

Zhihua Wang, Tsinghua University, China

Xiaohu You, Southeast University, China

Steering Committee Chair:

Fujiang Lin, USTC, China

TPC Co-Chair:

Liyuan Liu, IS-CAS, China

Dixian Zhao, Southeast University, China

International Advisors:

Jan Van der Spiegel, University Penn, USA

Christian Enz, EPFL, Switzerland

Yann Deval, University Bordeaux, France

Hoi-Jun Yoo, KAIST, Korea

Yong Lian, IEEE CASS, USA

Ke Wu, IEEE MTT-S, Canada

Albert Wang, IEEE EDS, USA

Makoto Ikeda, University of Tokyo, Japan

James Hwang，Lehigh University, USA

Local Arrangement Chair:

Jun Yang, Southeast University, China

Invited Program Chair:

Zhiqun Li, Southeast University, China

Tutorial Chair:

Nanjian Wu, IS-CAS, China

Keynote Speakers Chair:

Lin Cheng, USTC, China

Industry Papers Chair:

Hongtao Xu, Fudan University, China

Student Papers Chair:

Xian Tang, Tsinghua University, China

Program/Sessions Chair:

Weiwei Shan, SEU, China

Awards Committee Chair:

Zheng Wang, UESTC, China

Publication/Booklet Chair:

Nanjian Wu, IS-CAS, China

Submission Website Chair:

Qing Wu, BIE, China

Finance Chair:

Ying Zhang, BIE, China

Sponsorship/Exhibition Chair:

Weiwei Shan, Southeast University,China

Conference Manager:

Xing Zhang, BIE, China

TPC Member

1. RFIC and MMIC

Co-Chair:

Bo Zhao, Zhejiang University, China

Zheng Wang, UESTC, China

Members:

Xiaojun Bi , HUST, China

Ning Li , Sophia University, Japan

Haigang Feng, Tsinghua Shenzhen Institute, China

Xu Meng, Hefei University of Technology, China

Xi Zhu, University of Technology Sydney, Australia

Na Yan, Fudan University, China

Wei Deng, Tsinghua University, China

Rui Wu, IE, CAS, China

Jun Yin, University of Macau, China

Keping Wang, Tianjin University, China

Haikun Jia, Tsinghua University, China

Gang Zhang, Tongji University, China

Xiang Gao, Zhejiang University, China

Xisheng Diao, East China Normal University, China

Shiheng Yang, UESTC, China

2. Analog and Mixed-Signal ICs

Co-Chair:

Sai-Weng Sin,University of Macau, China

Qiang Li, UESTC, China

Members:

Zhijie Chen, Beijing University of Tech., China

Lin Cheng, USTC,China

Jianping Guo, Sun Yat-sen University, China

Yan Lu, University of Macau, China

Jiaxin Liu, Tsinghua University, China

Yuxuan Luo, Zhejiang University, China

Wanyuan Qu, Zhejiang University, China

Chenchang Zhan, SUSTc, China

Xian Tang, Tsinghua University Shenzhen, China

Xiong Zhou, UESTC, China

3. Digital ICs

Co-Chair:

Zhiyi Yu, Sun Yat-Sen University, China

Jun Zhou, UESTC, China

Members:

Shouyi Yin, Tsinghua University, China

Weiwei Shan, Southeast University, China

Youzhe Fan, MaxLinear Inc.,USA

Chao Wang, HUST, China

Ke Xu, ZTE, China

Jun Lin, Nan Jing University, China

Lin Li, Hisilicon, China

Fengwei An, SUSTech, China

Shanlin Xiao, Sun Yat-Sen University, China

Cong Shi, Chongqing University, China

4. Wireline ICs

Co-Chair:

Nan Qi, IS CAS, China

Feng Zhang, IMECAS, China

Members:

Quan Pan, SUSTech, China

Binhao Wang, HP Labs, USA

Dan Li, XJTU, China

Zhao Zhang, ISCAS, China

Xiaoyan Gui, XJTU, China

Min Tan, HUST, China

Xuqiang Zheng, IMECAS, China

Ziqiang Wang, Tsinghua University, China

Yong Chen, Macau University, China

5.Modeling, CAD and Testing

Co-Chair:

Yuehang Xu, UESTC, China

Members:

Jun Liu, HDU, China

Kai Lv, IME, CAS, Singapore

Ling Li, IME, CAS, China

Yunqiu Wu , UESTC, China

Yongxin Guo, NUS, Singapore

Peng Chen, Cardiff University, UK

Giovanni Crupi, University of Messina, Italy

6. Device and Process Technologies

Co-Chair:

Xingsheng Wang, HUST, China

Members:

Jiezhi Chen, Shandong University, China

Yi Li, HUST, China

Jing Wan, Fudan University, China

Bin Gao, Tsinghua University, China

Rongmei Chen, Imec, Belgium

Hong Wang, Xidian University, China

Binjie Cheng, Synopsys, UK

Runsheng Wang, Peking University, China

7. Packaging and Hybrid Integration

Co-Chair:

Jintang Shang, Southeast University, China

Tao Hang, Shanghai Jiaotong University, China

Members:

Jun Wang, Fudan University, China

Chenxi Wang, Harbin Institute of Technology, China

Qidong Wang, IMCAS,China

Yingxia Liu, BIT, China

Daquan Yu, Xiamen University, China

Chengqiang Cui, GDUT, China

Jian Cai, Tsinghua University, China

Xingchang Wei, Zhejiang University, China

Min Miao, BISTU, China

Sheng Sun, UESTC, China

Liguo Sun, USTC, China

Rongxiang Wu, UESTC,China

8.Sensors and Applications

Co-Chair:

Hao Yu, SUSTech, China

Members:

Guoyi Yu, HUST, China

Quan Chen, the University of Hong Kong,China

Fengwei An, the SUSTech, China

Gengzhen Qi, Institute of microelectronics,China

Xu Liu, Beijing University of Technology, China

Yongfu Li, Shanghai Jiao Tong University, China

Peng Feng, IS CAS, China

Xiwei Huang, Hangzhou Dianzi University, China

John Deepu, University College Dublin, Ireland

9. IC Based Applications

Co-Chair:

Zihao Chen, HIT, China

Kaixu Wang, HIT (Shenzhen), China

Members:

Bing Zhang, Sichuan University, China

Xi Zhu, U. of Technology Sydney, Australia

Junjun Wang, Beihang University, China

Haoshen Zhu, SCUTech, China

Sha Xu, GDUT, China

Zhuozhu Chen, GDUT, China

Yongkui Yang, SIAT, CAS, China

Zheng Wang, SIAT, CAS, China

10. Emerging Technologies and Applications

Co-Chair:

Haiding Sun, USTC, China

Members:

Tao Li, Southeast University, China

Lang Jiang, IC CAS, China

Mengmeng Li, IME, CAS, China

Zhaoliang Liao, USTC, China

Kai Wang, SUSTech, China

Hong Zhou, Xidian University, China

Tutorials

Tutorial 1A

Designing AI Accelerator Chips for the Smarter Future

Masato MOTOMURA,

Tokyo Institute of Technology, Japan

Tutorial 1B

Silicon Photonics

Technology and Applications

Yan CAI,

Shanghai Institute of Microsystem and Information technology, China

Tutorial 2A

Image Sensor - from Photon to Bit

Yang NI，

Tangram Image Sensor, France         

Tutorial 2B

Practical Design Examples & Advanced Circuit Techniques

Yan ZHU,

University of Macau, China

Plenary Talks  

6G Technologies–Opportunities and Challenges

Baiqing ZONG

State Key Lab of Mobile Network and Mobile Multimedia

Technology, ZTE, China

Trends in Optoelectronic IC for Recent Optical Module and Photonics Integration

Ben CHEN

Hengtong Optic-Electric Co., Ltd., China

Keynote Lectures  

Break the kT/C Noise Limit

Nan SUN

Tsinghua University, China

Resistive switching memory, from device to applications

Hangbing LV

Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics of

Chinese Academy of Sciences, Beijing, China

Silicon Photonics: A Key Alternative for the Post-Moore Era

Zhiping (James) ZHOU

Peking University, China

Switched-Capacitor DC-DC Converter: An Algorithmic Topology Generation Approach

Man-Kay Law

University of Macau, China

Radio Frequency Microsystems for 5G and IoT

Songbin Gong

University of Illinois at Urbana Champaign, USA

Nanoscale Spintronic Memories for Energy-Efficient Computing

Weisheng ZHAO

Beihang University, China

Focus Sessions  

Focus 0: Image Porcessing for Humanoid Robots

Time: 09:20-10:20 Tuesday, November 24

Location: #367 181 155

Session Chairs: Chun Zhang

Robot Navigation Based on Pseudo-Binocular Stereo Vision and

Linear Fitting

Huanshihong Deng, Pingcheng Dong, Zhuoao Li, Haoran Lyu,

Yangyi Zhang, Yiwei Luo, Fengwei An

School of Microelectronics, Southern University of Science and

Technology and Engineering, China

The Optimization of Object Detection and Localization in

Complex Background for Vision-based Robot

Bowen Sun, Jingjie Wei, Xian Tang

Shenzhen International Graduate School, Tsinghua University,

Shenzhen, China

A Practical ROI and Object Detection Method for Vision Robot

Hao Shi, Qi Peng, Jiachen Yang, Xudong Bai, Yiqi Zhuang

Xidian University, Xi’an, Shaanxi, China

Focus 1: CIS

Time: 09:20-10:20 Tuesday, November 24

Location: #101 815 397

Session Chairs: Tao Yin

A Full Frame 8K 120fps 3D stacking CMOS Image Sensor for

Broadcasting Applications

Yang Li

Gpixel Inc.

ASIC Design Based on Yolo Object Detection Algorithm and

Zero-DCE Weak Light Target Detection Algorithm

Dongming Yan

Institute of Automation, Chinese Academy of Sciences

Research and Innovation in Behavioral Decision-Making, Image

Recognition, and Action Control of Humanoid Robot

Aoqi Li, Zixian Zhao, Hanqiao Ye, Jiangang Li

School of Mechanical Engineering and Automation, Harbin

Institute of Technology(Shenzhen), China

Focus 2: Inductors & Transformers based Circuits

Time: 14:20-15:20 Tuesday, November 24

Location: #101 815 397

Session Chairs: Bo Zhao

Class B/C High Performance LC VCO’s

Gang Zhang

Tongji University, China

Source-to-Drain Transformer-Feedback VCOs For Power-

Efficient IoT and MM-Wave Transceivers

Jun Yin

University of Macau, China

The Design and Applications of On-Chip Transformers in RF

and Millimeter-Wave Circuits

Haukun Jia

Tsinghua University, China

Focus 3: Analog

Time: 09:20-10:20 Wednesday, November 25

Location: #401 458 652

Session Chairs: Sai-Weng Sin

Analog Multiplexing Techniques for Multi-channel and Multiparameter

Sensor Interfaces

Yuxuan Luo

Zhejiang University, China

Error Suppression Techniques for Energy-Efficient High-

Resolution SAR ADCs

Jiaxin Liu

Tsinghua University, China

Hybrid DC-DC Converter

Mo Huang

University of Macau, China

Focus 4: Photonics and Microelectronics Co-integration Session

Time: 16:40-17:55 Wednesday November 25, 2020

Location: #377 618 375

Session Chairs: Min Tan

CUMEC silicon photonics platform

Junbo Feng

CUMEC, China

Circuit-Level Convergence of Electronics and Photonics: Basics

and Recent Advances

Min Tan

Huazhong University of Science and Technology, China

First Demonstration of Closed-Loop PWM Wavelength Locking

of a Microring Resonator in a Monolithic Photonic-BiCMOS

Platform

Da Ming, Zhicheng Wang, Yuhang Wang, Min Tan

Huazhong University of Science and Technology, China

Wavelength Locking Techniques for Resonator-Based Silicon

Photonic Switches

Ciyuan Qiu

Shanghai Jiaotong University, China

Focus 5: 2D-based Transistors and Novel Devices Application Session

Time: 16:40-17:40 Wednesday November 25, 2020

Location: #851 335 508

Session Chairs: Hong Zhou, Qiaoling Tong

Controllable Aggregation of Conjugated Polymer Monolayer:

from Field-Effect Transistors to Integrated Circuits

Mengmeng Li

Institute of Microelectronics, Chinese Academy of Sciences, China

Intriguing X-enes and Their Field-Effect Transistor Devices

Li Tao

Southeast University, China

Design of Basic Block of Neural Signal Detection Chip Classifier

Yongqian Su, Yang Hong, Weiwei Shi, Mengtao Ye, Lizhi Hu

Shenzhen University, China