-Plenary Talks
             -Keynote Lectures

             -Focus session




The 2nd IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA 2019),  will be held November 13-15, 2019 in Chengdu, China. This new conference will be held annually in China to provide an international forum according to IEEE standard for the presentation and exchange of the latest technical achievements and cross-discipline fertilization of IC designs, technologies, and applications in our fast-changing society. This years theme is continue as Sensors, Integrated Circuits and Systems for IoT and 5G. ICTA 2019 welcomes papers of new and innovative discoveries and designs on

Topics include, but are not limited to, the following technical areas:

1.      RFIC and MMIC: Si-based RFIC building-block circuit, compound-semiconductor-based MMIC building-block circuit, LNA, PA, VCO, PLL, phase shifter, mixer, RF switch, balun, driver amplifier, transceiver, etc.

2.      Analog and Mixed-Signal ICs:  power management and energy harvesting device and system, amplifier, comparator, filter, AGC, VGA, ADC, DAC, etc.

3.      Digital ICs and Memory: SoC, processor, FPGA, AI and deep-learning processor, DSP, NoC, memory, etc.

4.      Wireline ICs: high-speed data link, optical transceiver, SerDes, CDRs, equalizer, modulator, etc.

5.      Modeling, CAD and Testing: compact models and extraction techniques (silicon based), SPICE models and extraction techniques (non-silicon), modeling technique of GaN, SiC, ASM-HEMT, 2D-material-based devices, quantum devices, test structures design and model parameter extraction, RF calibration and reliable data acquisition, CAD, EM/TCAD simulation, co-simulation and verification technique, PDK validation, etc.

6.      Device and Process Technologies: CMOS, FinFET, junctionless device, negative capacitance device, UT-SOI, LDMOS, HEMT, HBT, SiGe, GaAs, InP, GaN, 3rd generation materials, MEMS, device characterization, device FAR, 3D integration, TSV, etc.flash, OPT, MPT, SRAM, DRAM, 3D NAND, MRAM, RRAM, PCRAM, FeRAM, crossbar, DRAM+MCU, etc.

7.      Packaging and  Hybrid Integration: Active antenna, EM field, filters, Hybrid MIC, MCM, SiP, SoP, TSV, flip chip assembly, wire bonding, anisotropic conductive film, interconnection technologies, multi-physics and multiscale EM computation/simulation, 3D packaging, etc.

8.      Sensors and Applications: MEMS sensors, image sensors, physical sensors, chemical sensors, bio-sensors, smart and intelligent sensors, sensor interface, sensor technology and applications, etc.

9.      IC Based Applications: IC based module and system integration, automotive electronics, automotive radar, 5G systems, AI systems, IoTs, healthcare and biomedical systems, etc.

10.    Emerging Technologies and Applications: 2D materials, green and implantable materials, neuromorphic device, optoelectronic device, device characterization, etc.


Paper submission and deadlines:

To encourage timely reporting of the latest results and to have better opportunities to expand papers for possible journal publications, prospective authors are invited to submit a 2-page paper (both initial submission and final version, if accepted) in English and in IEEE Xplore PDF format. The paper should emphasize original contributions and key findings, including figures, diagrams and results from verified simulations with direct or indirect measurements. Up to 2 additional pages of figures supporting initial submission which will not in final publication are encouraged. References should be clearly cited and up-to-date. Invited papers can extend up to 6 pages submission. By submitting an extended abstract, the authors promise that, if accepted, at least one of them will attend ICTA2019 with full registration.

Manuscript submission deadline:                            July 28, 2019 (Sunday)

Notification of acceptance:                                           September 2, 2019 (Monday)

Submission of final extended abstract:                     October 13, 2019 (Sunday)

       Upload online to:                                                 


       Website: or

About ICTA and What is New?

China is becoming a semiconductor hub for academia, industry and market. However, young Chinese researchers, in particular students, lack the opportunity to attend IEEE conferences. International counterparts also wish to experience firsthand the fast-growing semiconductor sector in China. To this end, ICTA was founded by a group of Chinese scholars and will be held annually in China. It will be a broad yet advanced forum for IC designs, technologies and applications worldwide.

The conference will feature both invited and contributed papers. Distinguished researchers will be invited to deliver keynote speeches on technology or circuit trends and significant advances. The best contributed papers will be selected for awards. All papers will be presented in parallel sessions, including invited talks and focused sessions. ICTA will start with FREE Distinguished Lectures and concluded with forums/workshops. Exhibition showcasing the latest engineering samples, tools and technology options will be facilitated as well. More information can be found at or

      Both invited and contributed papers that are accepted by ICTA will appear in IEEE Xplore.

What is new? Authors are invited to submit an extend version of 5+ pages to the special issue of Journal of Semiconductor (JOS), thus possibly extending the conference abstract into a journal paper which will also appear in IEEE Xplore. The extended paper should reflect reviewers opinions and audience feedbacks from ICTA.  

Author registration and paper submission steps:

1.     Author registration form: title, author(s) and affiliation(s), and statement of exclusivity. This form includes also a 30-50-word abstract (description of the subject, its importance, and how the work contributes to the field). This information is required and must be submitted via the website:

2.     Authors must use the template provided on the above website to format their extended abstract. The extended abstract may not exceed 2 pages total and the file size must be less than 2 MB. For PDF files, use Distiller and select embed all fonts. Please note that we accept no *.doc files.

3.     Submission deadline:  July 28, 2019 (Sunday)

Paper selection criteria: All submissions must be in English. Papers will be selected based on the following factors:

       Originality: The paper must be unique, significant, and state-of-the-art. Are references to existing literature included?

       Quantitative content: The 2-page extended abstract should give an explicit description of the work with supporting data.

       Quality: Clarity of the writing and figures. What is the context of the contribution to previous work?

       Interest to ICTA attendees: Why should this work be reported at this conference?


About Chengdu ɶ

Chengdu, the capital city of China's southwest Si­chuan Province, is famed for being the home of cute giant pandas. Located in the west of Sichuan Basin and in the center of Chengdu Plain, the city covers a total area of 12.3 thousand square kilometers (4,749 square miles) with a population of over 11 million.

Benefiting from Dujiangyan Irrigation Project which was constructed in 256 B.C., Sichuan Province is reputed as the Heavenly State, Tian Fu Zhi Guo in Chinese, literally a place richly endowed with natural resources. Chengdu, as the capital, is extremely productive. The Min and Tuo Rivers, two branches of the Yangtze River, connected to 40 other rivers, supply an irrigation area of more than 700 square kilometers (270.27 square miles) with 150-180 million kilowatts of water. Consisting of abundant mineral resources, the land is extremely fertile.