Technical Program Committee |
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1. RFIC and MMIC |
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Co-Chair: |
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Bo Zhao, ZJU, China | Zheng Wang, UESTC, China |
Members: |
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Xiaojun Bi, HUST, China |
Haigang Feng, Tsinghua Shenzhen Institute, China |
Wei Deng, Tsinghua University, China | Na Yan, Fudan, China |
Keping Wang, Tianjing University, China | Haikun Jia, Tsinghua University, China |
Xiang Gao, Zhejiang University, China | Shengxi Diao, ECNU, China |
Shiheng Yang, UESTC, China | Jian Pan, Tokyo Institute of Technology, Japan |
Yun Wang, Fudan University, China |
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2. Analog and Mixed-Signal ICs |
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Co-Chair: |
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Sai-Weng Sin, University of Macau, China | Lin Cheng, USTC,China |
Members: |
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Zhijie Chen, Beijing U of Tech., China |
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Jianping Guo, Sun Yat-sen University,
China | Jiaxin Liu, UESTC, China |
Yuxuan Luo, Zhejiang University, China | Wanyuan Qu, Zhejiang University, China |
Chenchang Zhan, SUSTc, China | Xian Tang, Tsinghua University Shenzhen,
China |
Xiong Zhou, UESTC, China | Liang Qi, Shanghai Jiaotong University,
China |
Mo Huang, University of Macau, China | Haoyu Zhuang，UESTC, China |
| Dongfang Pan, USTC,China | Bing Yuan, Xidian University, China |
3. Digital ICs and Memory |
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Co-Chair: |
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Jun Zhou, UESTC, China | Zhiyi Yu, Sun Yat-Sen University, China |
Members: |
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Shouyi Yin, Tsinghua University ,
China | Weiwei Shan, Southeast University, China |
Chao Wang, HUST, China | Jun Lin, Nanjing University, China |
Shanlin Xiao, Sun Yat-Sen University,
China | Cong Shi, Chongqing University, China |
Chang Liang, UESTC, China | Yanan Sun, Shanghai Jiaotong University,
China |
| Lin Li, Hisilicon | Longyang Lin, SUST, China |
| Hao Cai, Southeast University, China | Yanhan Zeng, Guangzhou University, China |
4. Wireline ICs |
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Co-Chair: |
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Nan Qi, ISCAS, China | Feng Zhang, IMECAS, China |
Members: |
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Quan Pan, SUSTech, China | Zhao Zhang, ISCAS, China |
Binhao Wang, OPMCAS, China | Xiaoyan Gui, XJTU, China |
Dan Li, XJTU, China | Min Tan, HUST, China |
Xuqiang Zheng, IMECAS, China | Ziqiang Wang, Tsinghua University, China |
Yong Chen, Macau University, China |
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5.Modeling, EDA and Testing |
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Co-Chair: |
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Yuehang Xu, UESTC, China | Jun Liu, HDU, China |
Members: |
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Liang Zhou, Shanghai Jiaotong University, China | Giovanni Crupi, University of Messina, Italy |
Kai Lv, Shanghai Simchip Technology Group Co. Ltd, China | Yunqiu Wu, UESTC, China |
Peng Chen, Southeat University, China | Yonghao Jia, NWPU, China |
Letian Huang , UESTC，China | Yang Lu, Xidian. University, China |
6. Device and Process Technologies |
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Co-Chair: |
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Bin Gao, Tsinghua University, China |
Members: |
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Hong Wang, Xidian University, China |
Yijiao Wang, Beihang University, China |
Binjie Cheng, Synopsys, UK |
Xiao Gong, NUS, Singapore |
Can Li, University of Hong Kong, China | Zongwei Wang ，Peking University，China |
Bing Chen，Zhejiang University，China | Jie Liang，Shanghai University，China |
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7. Packaging and Hybrid Integration |
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Co-Chair: |
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Chenxi Wang, HIT, China | Jun Wang, Fudan University, China |
Members: |
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Jintang Shang, Southeast University, China |
Tao Hang, Shanghai Jiaotong University, China |
Qidong Wang, IMCAS, China |
Yingxia Liu, City University of Hong Kong, China |
Xingchang Wei, Zhejiang University, China |
Jian Cai, Tsinghua University, China |
Min Miao, BISTU, China |
Sheng Sun, UESTC, China |
Liguo Sun, USTC, China |
Rongxiang Wu, UESTC, China |
Chengqiang Cui, GDUT, China |
Daquan Yu, Xiamen University, China |
Wenhua Yang, Anhui University, China |
Ran He, Huawei Technologies Co., China |
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8. Sensors and Applications |
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Co-Chair: |
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Fengwei An, SUSTech, China |
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Members: |
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Guoyi Yu, HUST, China |
Quan Chen, SUSTech, China |
Gengzhen Qi, Sun Yat-Sen University, China | Xu Liu, BJUT, Chinaa |
Xiwei Huang, HDU, China |
Yongfu Li, Shanghai Jiaotong University, China |
John Deepu, UCD, Ireland | Xingyuan Tong, XUPT, China |
Jian Zhao, Shanghai Jiaotong University, China |
Kameng Lei, University of Macau, China |
Peng Feng, ISCAS, China |
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9. IC Based Applications |
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Co-Chair: |
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Zheng Wang, SIAT, China
| Enyi Yao, SCUT, China |
Members: |
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Zihao Chen, HIT (Shenzhen), China |
Yongkui Yang, SIAT, China |
Aijiao Cui, Harbin Institute of Technology, China |
Xin Lou, ShanghaiTech University, China |
Tao Tang, Zhejiang lab, China | Chen Lang, Sydnicon RF, Australia |
Hao Zhang, Gusu Laboratory of Materials, China |
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10. Emerging Technologies and Applications |
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Co-Chair: |
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Haiding Sun, USTC, China |
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Members: |
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Li Tao, Southeast University, China |
Mengmeng Li, IME, CAS, China |
Zhaoliang Liao, USTC, China |
Kai Wang, SUSTech, China |
Qiaoling Tong, HUST, China |
Wei Cao, Univ of California, Santa Barbara, USA |
Hong Zhou, Xidian University, China | Zhengguo Xiao, USTC, China |
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11. Intelligent Robots |
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Co-Chair: |
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Chun Zhang, Tsinghua University, China | Qi Peng, Xidian University, China |
Members: |
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Songping Mai, Tsinghua Shenzhen, China | Zhongyi Chu, Beihang Univeristy, China |
Qingguo Zhou, Lanzhou Univerity, China | Gang Chen, Sun Yat-Sen University, China |
Yixing Zhao, DGUT, China |
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