1. RFIC and MMIC

Co-Chair:

Zhao Bo, Zhejiang University, China

Wang Zheng, UESTC, China

Members:

Bi Xiaojun, HUST, China

Li Ning, Sophia University, Japan

Feng Haigang, Tsinghua Shenzhen  Institute, China

Meng Xu, Heifei U. of Technology, China

Zhu Xi, U. of Technology Sydney,  Australia

Deng Wei, Tsinghua University, China

Yan Na, Fudan, China

Wu Rui, IECAS, China

Yin Jun, University of Macau, China

Wang Keping, Tianjing University, China

Jia Haikun, Tsinghua University, China

Gao Xiang, Zhejiang University, China

Zhang Gang, Tongji University, China

Diao Shengxi, ECNU, China

Yang Shiheng, UESTC, China

Pang Jian, Tokyo Institute of  Technology, Japan

Luo Xun, UESTC, China

2. Analog and Mixed-Signal ICs

Co-Chair:

Sin Sai-Weng University of Macau, China

Li Qiang, UESTC, China

Members:

Chen Zhijie, Beijing U of Tech., China

Cheng Lin, USTC,China

Guo Jianping, Sun Yat-sen University,  China

Liu Jiaxin, UESTC, China

LuoYuxuan, Zhejiang University, China

Qu Wanyuan, Zhejiang University, China

Zhan Chenchang, SUSTc, China

Tang Xian, Tsinghua University Shenzhen,  China

Zhou Xiong, UESTC, China

Qi Liang, Shanghai Jiaotong University,  China

Huang Mo, University of Macau, China

3. Digital ICs and Memory

Co-Chair:

Zhou Jun, UESTC, China

Yu Zhiyi, Sun Yat-Sen University, China

Members:

Yin Shouyi, Tsinghua University ,  China

Shan Weiwei, Southeast University, China

Wang Chao, HUST, China

Lin Jun, Nanjing University, China

Xiao Shanlin, Sun Yat-Sen University,  China

Shi Cong, Chongqing University, China

Liang Chang, UESTC, China

Sun Yanan, Shanghai Jiaotong University,  China

4. Wireline ICs

Co-Chair:

Qi Nan, ISCAS, China

Zhang Feng, IMECAS, China

Members:

Pan Quan, SUSTech, China

Zhang Zhao, ISCAS, China

Wang Binhao, OPMCAS, China

Gui Xiaoyan, XJTU, China

Li Dan, XJTU, China

Tan Min, HUST, China

Zheng Xuqiang, IMECAS, China

Wang Ziqiang, Tsinghua University, China

Chen Yong, Macau U., China

5.Modeling, CAD and Testing

Co-Chair:

Xu Yuehang, UESTC, China

Members:

Liu Jun, HDU, China

Ma Xiaohua, Xidian. University, China

Zhou Liang, Shanghai Jiaotong  University, China

Crupi Giovanni, University of Messina,  Italy

Lv Kai, IMECAS, China

Wu Yunqiu, UESTC, China

Chen Peng, Cardiff University, UK

Jia Yonghao, NWPU, China

6. Device and Process Technologies

Co-Chair:

Gao Bin, Tsinghua University, China

Members:

Wang Xingsheng, HUST, China

Wang Runsheng, Peking University, China

Chen Jiezhi, Shangdong Univ., China

Wang Hong, Xidian University, China

Wang Yijiao, Beihang University, China

Chen Rongmei, Imec, Belgium

Cheng Binjie, Synopsys, UK

Gong Xiao, NUS, Singapore

Li Can, University of Hong Kong, China

7. Packaging and Hybrid Integration

Co-Chair:

Wang Chenxi, HIT, China

Wang Jun, Fudan University, China

Members:

Shang Jintang, Southeast University,  China

Hang Tao, Shanghai Jiaotong University,  China

Wang Qidong, IMCAS, China

Liu Yingxia, BIT, China

Wei Xingchang, Zhejiang University,  China

Cai Jian, Tsinghua University, China

Miao Min, BISTU, China

Sun Sheng, UESTC, China

Sun Liguo, USTC, China

Wu Rongxiang, UESTC, China

Cui Chengqiang, GDUT, China

Yu Daquan, Xiamen University, China

Yang Wenhua, Anhui University, China

He Ran, Huawei Technologies Co., China

8.Sensors and Applications

Co-Chair:

An Fengwei, SUSTech, China

Members:

Feng Peng, ISCAS, China

Yu Guoyi, HUST, China

Chen Quan, SUSTech, China

Qi Gengzhen, Sun Yat-Sen University, China

Liu Xu, BJUT, China

Huang Xiwei, HDU, China

Li Yongfu, Shanghai Jiaotong University,  China

Deepu John, UCD, Ireland

Tong Xingyuan, XUPT, China

Zhao Jian, Shanghai Jiaotong University,  China

Lei Kameng, University of Macau, China

9. IC Based Applications

Co-Chair:

Chen Zihao, HIT (Shenzhen), China

Zhu Xi, U. of Technology Sydney,  Australia

Members:

Wang Kaixu, HIT (Shenzhen), China

Zhang Bing, Sichuan University, China

Yang Yongkui, SIAT, China

Wang Zheng, SIAT, China

Zhu He, U. of Technology Sydney,  Australia

Chen Lang, Sydnicon RF, Australia

Yao Enyi, SCUT, China

10. Emerging Technologies and Applications

Co-Chair:

Sun Haiding, USTC, China

Members:

Tao Li, Southeast University, China

Li Mengmeng, IME, CAS, China

Liao Zhaoliang, USTC, China

Wang Kai, SUSTech, China

Zhou Hong, Xidian University, China

Xiao Zhengguo, USTC, China

11. Intelligent Robots

Co-Chair:

Zhang Chun, Tsinghua University, China

Peng Qi, Xidian University, China

Members:

Mai Songping, Tsinghua Shenzhen, China

Chu Zhongyi, Beihang Univeristy, China

Zhou Qingguo, Lanzhou Univerity, China

Chen Gang, Sun Yat-Sen University, China

Zhao Yixing, DGUT, China