The 4th IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA 2021, conference code:53157), will be held on November, 2021 in Zhuhai, China. This new conference will be held in China to provide an international forum according to IEEE standard for the presentation and exchange of the latest technical achievements and cross-discipline fertilization of IC designs, technologies, and applications in our fast-changing society. This year’s theme is “Sensors, Integrated Circuits and Systems for Intelligent Society”. ICTA 2021 welcomes papers of new and innovative discoveries and designs on
Topics include, but are not limited to, the following technical areas:
1. RFIC and MMIC: Si-based RFIC building-block circuit, compound-semiconductor-based MMIC building-block circuit, LNA, PA, VCO, PLL, phase shifter, mixer, RF switch, balun, driver amplifier, transceiver, etc.
2. Analog and Mixed-Signal ICs: power management and energy harvesting device and system, amplifier, comparator, filter, AGC, VGA, ADC, DAC, etc.
3. Digital ICs and Memory: SoC, processor, FPGA, AI and deep-learning processor, DSP, NoC, memory, etc.
4. Wireline ICs: high-speed data link, optical transceiver, SerDes, CDRs, equalizer, modulator, etc.
5. Modeling, CAD and Testing: compact models and extraction techniques (silicon based), SPICE models and extraction techniques (non-silicon), modeling technique of GaN, SiC, ASM-HEMT, 2D-material-based devices, quantum devices, test structures design and model parameter extraction, RF calibration and reliable data acquisition, CAD, EM/TCAD simulation, co-simulation and verification technique, PDK validation, etc.
6. Device and Process Technologies: CMOS, FinFET, junctionless device, negative capacitance device, UT-SOI, LDMOS, HEMT, HBT, SiGe, GaAs, InP, GaN, 3rd generation materials, MEMS, device characterization, device FAR, 3D integration, TSV, etc.flash, OPT, MPT, SRAM, DRAM, 3D NAND, MRAM, RRAM, PCRAM, FeRAM, crossbar, DRAM+MCU, etc.
7. Packaging and Hybrid Integration: Active antenna, EM field, filters, Hybrid MIC, MCM, SiP, SoP, TSV, flip chip assembly, wire bonding, anisotropic conductive film, interconnection technologies, multi-physics and multiscale EM computation/simulation, 3D packaging, etc.
8. Sensors and Applications: MEMS sensors, image sensors, physical sensors, chemical sensors, bio-sensors, smart and intelligent sensors, sensor interface, sensor technology and applications, etc.
9. IC Based Applications: IC based module and system integration, automotive electronics, automotive radar, 5G systems, AI systems, IoTs, healthcare and biomedical systems, etc.
10. Emerging Technologies and Applications: 2D materials, green and implantable materials, neuromorphic device, optoelectronic device, device characterization, etc.
11. Intelligent Robots: robot kinematics/dynamics/control, system integration, AI in robotics, sensor/actuator, bio-inspired systems, robot perception, human robot interaction, and robot vision, etc.
Paper submission and deadlines:
To encourage timely reporting of the latest results and to have better opportunities to expand papers for possible journal publications, prospective authors are invited to submit a 2-page paper (both initial submission and final version, if accepted) in English and in IEEE Xplore PDF format. The paper should emphasize original contributions and key findings, including figures, diagrams and results from verified simulations with direct or indirect measurements. Up to 2 additional pages of figures supporting initial submission which will not in final publication are encouraged. References should be clearly cited and up-to-date. Invited papers can extend up to 6 pages submission. By submitting the paper, the authors promise that, if accepted, at least one of them will attend ICTA 2021 with full registration.
Manuscript submission deadline: August 16, 2021
Notification of acceptance: September 6, 2021
Submission of final extended abstract: October 8, 2021
Website:http://www.ieee-icta.cn/Submission.html
Download: ICTA2021-CFP-2nd.pdf
